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Solder Paste In Jar 50g (T3) Sn63/Pb37 No Clean -
Solder Paste In Jar 50g (T3) Sn63/Pb37 No Clean -

Solder Paste In Jar 50g (T3) Sn63/Pb37 No Clean -

$ 11.6

Availability: 100 in stock
  • Tax: This item without tax
  • Brand: Brand Chip Quik
  • Item must be returned within: 30 Days
  • Refund will be given as: Money Back
  • All returns accepted: Returns Accepted
  • Condition: New
  • MPN: does not apply
  • UPC: does not apply
  • Color: does not apply
  • Return shipping will be paid by: Buyer
  • Model Number: SMD291AX50T3
  • Category: Solder
  • Shipping: Fast Two-day shipping

    Description

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    Solder Paste in jar 50g (T3) Sn63/Pb37 no clean - -
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    Product Description
    Features
    Description
    Description Solder Paste in jar 50g (T3) Sn63/Pb37 no clean 90.25% metal. Alloy: Sn63/Pb37 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 90.25% metal by weight. Particle Size: T3 (25-45 microns) Melting Point: 183C (361F) Size: 50g jar Shelf Life Refrigerated >12 months, unrefrigerated >6 months Stencil Life >8 hours 20-50% RH 22-28C (72-82F) >4 hours 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will impact this product's stated shelf life.
    Technical Details
    Brand:
    Brand Chip Quik
    Category:
    Solder
    Color:
    Manufacturer Part Number (MPN):
    Model:
    SMD291AX50T3
    Manufacturer:
    Package Dimension: 1.1 x 1.7 x 1.7 inchs., Weight: 0.11lbs.
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