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Kester RF741 No-Clean Electronics Rework Flux 6cc Syringe Power Soldering

$ 14.93

Availability: 100 in stock
  • Condition: New
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  • Tax: This item without tax
  • Shipping: Fast Two-day shipping
  • Item must be returned within: 30 Days
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  • All returns accepted: Returns Accepted
  • Refund will be given as: Money Back

    Description

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    Kester RF741 No-Clean Electronics Rework Flux 6cc Syringe - Power Soldering Accessories -
    Gallery
    Product Description
    Features
    18 gauge dispensing tips as pictured for precision dispensing of flux.
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    6cc syringe contains enough flux for 15-20 BGA repairs
    Compatible with most no-clean solders and fluxes.
    High Viscosity- stays where you put it.
    Lead Free - RoHS pliant.
    Description
    Designed for BGA and QFP repair. 6 CC syringe for convenient dispensing during electronic repairs.
    TekLine TRF741 is a high-viscosity No-Clean paste flux developed for printed circuit board rework or repair. TRF741 is effective for prototype work where a small amount of flux is needed on a specific area of a board or assembly. The high viscosity flux stays in place until soldering occurs. Excellent performance in applications requiring a flux having good thermal stability such as surface mount ponent or repair.
    It is the ideal choice for QFP or BGA rework operations. It is also well suited for use with through-hole repair operations.
    Residues that remain after soldering are almost colorless, leaving a visually appealing repair. The residue is safe to be left on the assembly after soldering.
    Technical Details
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